Senior Engineer, Packaging Engineering (Die Prep New Process Development)

At Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what’s next. To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others. When you join Western Digital, you join a legacy more than 50 years in the making. Across our Western Digital®, SanDisk®, SanDisk® Professional, WD® and WD_BLACK™ brands, we have brought some of the most storied advancements in memory and data storage technology to market—and our best, most innovative work is yet to come. From energizing gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future. Here’s how you can help.

Job Description

Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing.

• New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material

  qualifications

  , new machine

  qualifications

  and new process

  qualifications

• Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing, tape & reel), perform complete window study, DOEs, corner limits
• Golden recipe setup for new package qualification
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets
• Process transfer from Development to New product Introduction team & from site to site
• Work closely with Cross site’s Product development & design team to understand the Package Design Rules & Requirements
• Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology

Qualifications

REQUIRED:

• Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, & etc)
• Min 2 years of working experience in Semiconductor Process development
• Process engineering/ NPI engineering background
• Knowledge in Semiconductor assembly processes

PREFERRED:

• Min 4 years of working experience in Semiconductor Process development
• Process engineering/ NPI engineering background with either one of the processes below: wafer thinning/ backgrinding, Mechanical dicing, laser dicing/ laser grooving, wafer inspection/ Automatic optical inspection, stealth dicing
• Innovative, have patent disclosure will be an added advantage.
• Knowledge in Artificial Intelligent and machine learning, an added advantage
• Experience in Process transfer from Development to New product Introduction team & from site to site

SKILLS:

• Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology
• Knowledge of Design Of Experiment (DOE)
• Familiarize with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP
• Good project planning, strong sense of quality and urgency
• Team leads with good communication and interpersonal skills.

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at  jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Western Digitals Ethics Helpline  or email compliance@wdc.com