Home Malaysia Manufacturing Engineer (Wirebond)

Home Malaysia Manufacturing Engineer (Wirebond)

Manufacturing Engineer (Wirebond)

Full time at Hewlett Packard Enterprise in Malaysia
Posted on January 13, 2025

Job details

Add expected salary to your profile for insights. Job Title: Manufacturing Engineer (Wirebond) Description: Applies developed subject matter knowledge to solve common and complex business issues within established guidelines and recommends appropriate alternatives. Works on problems of diverse complexity and scope. May act as a team or project leader providing direction to team activities and facilitates information validation and team decision-making processes. Exercises independent judgment within generally defined policies and practices to identify and select a solution. Ability to handle most unique situations. May seek advice in order to make decisions on complex business issues. Responsibilities:

  • Well experienced in wirebond machine and responsible for product characterization and qualification of changes and well experienced in performing evaluations. Preferable with KNS machine experience.
  • Designs engineering solutions, including methods, operation sequences, and processes for the manufacturing of parts, component sub-assemblies, and final assemblies, based on established engineering principles and in accordance with general specifications and requirements.
  • Develops and implements cost estimates, capacity models, time standards, production area layouts, and recommendations for tooling and process requirements for new product introductions.
  • Collaborates and communicates with management, internal, and outsourced manufacturing, development partners, cross-department regarding process and standards compliance, recording and reporting issues, and recommendations for problem resolution for the manufacture of existing products.
  • Leads a project team of other manufacturing engineers and internal and outsourced manufacturing partners to develop and execute reliable, cost-effective, high-quality technical manufacturing solutions and bonding profile optimization for moderately-complex products from new product introduction through end of lifecycle.
  • Represents the manufacturing engineering team for all phases of larger and more complex development and manufacturing projects.
  • Provides guidance and mentoring to less-experienced staff members.
Education And Experience Required:
  • Bachelor's or Master's degree in a technology or manufacturing-related engineering discipline or equivalent.
  • Typically 4-6 years’ experience.
Knowledge And Skills:
  • Using engineering tools and software packages to design and automate manufacturing processes.
  • Strong analytical and problem-solving skills.
  • Understanding of material properties and hardware and electrical component design.
  • Using empirical analysis, modeling, and methodologies to validate manufacturing process and tooling design and specifications.
  • Excellent written and verbal communication skills; mastery of English and local language.
  • Ability to effectively communicate manufacturing plans, proposals, and results, and negotiate options at management levels.
Schedule: Full time Equal Opportunity Employer (EEO): HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). #J-18808-Ljbffr

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