Graduate Technical Program (GTP - Plasma Etch Process Engineering)
Full time
at Infineon Technologies AG
in
Malaysia
Posted on December 26, 2024
Job details
Job Description In your new role you will:
- Each trainee must follow and complete the compulsory training defined by module or department.
- The selected candidates shall be exposed to the Plasma Etch process in wafer fabrication and gain knowledge on the industrial practices and required competencies.
- Production line sustaining (lot disposition, process control, line issue troubleshooting, process release).
- Improvement projects (process margin / Cpk / yield improvement, cost reduction, capacity improvement).
- New tool startup.
- Knowledge and experience in the following would be added advantages:
- Knowledge of processes in the semiconductor industry.
- Knowledge of SPC, FMEA.
- Degree in Chemistry, Electrical & Electronic Engineering, Material Science, Mechanical Engineering, Microelectronics, Physics, or Process Engineering.
- Good command of the English language.
- Minimum CGPA of 3.00 or equivalent.
- The Trainee shall be committed to 12 months of service.
- Applicants must be willing to work in Kulim Hi-Tech Park.
- No work experience required.
- Contract position(s) available.
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