PRINCIPAL R&D/PRODUCT DVL ENGINEER
Job details
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products and are responsible for product development and qualification from market definition through production and release. They assist in the qualification of suppliers for new products to ensure quality parts, materials, and services for new or improved manufacturing processes. The teams conduct feasibility studies, testing on new and modified designs, and support detailed design, testing, prototype fabrication, and manufacturing ramp. They provide all required product documentation including Solid Model, 2D/3D production drawings, product specifications, and testing requirements. Job Description Subject matter expert in signal integrity design, simulation and validation activities through product development cycles. Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers. Performing signal integrity simulations for multiple high-speed standards on each product, determining the correct simulation methodology and setup to use. Driving product development for business success. Engaging in innovative simulation and test tool improvement and process enhancement. Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writing and presenting technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions. Requirements Bachelor’s degree in Electrical Engineering; Master's Degree preferred. Minimum of 10 years of relevant work experience in electrical Design, RF design, or PCB design. A solid understanding of electromagnetic theory and electrical circuit behavior. Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools). Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent). Expert with high-speed test equipment (VNA, TDR, BERT). Expert with interconnect design or electronic packaging, focusing on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration. Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially associated with connector FP and card-edge interfaces. Proficient with data analysis techniques and appreciation for design geometry tolerance impacts. Experience with physical layer communications systems and architectures. Fluent in English (both verbal and written). Ability to work in a global environment – accommodating varying time zones and collaborating with individuals across geographies. Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions. Open minded, coachable, willing to learn new skills, and motivated to grow. Pro-active in identifying complex situations, providing solutions, and driving improvements to evolving procedures. Experience writing technical papers and presenting to BU-level organizations, external conferences, and critical customer contacts. Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering & manufacturing teams. Nice to Have Skills/Experience: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system. Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems). Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English. Strong organizational and time management skills with an ability to manage multiple tasks/deadlines/projects simultaneously. Experience in project leadership, especially as it applies across design, development & manufacturing teams. What your background should look like: Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork Location: Singapore, 01, SG, 239920 Travel: 10% to 25% Requisition ID: 122142#J-18808-Ljbffr
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