Home Online Power Packages Designer - 2D and 3D design / Semiconductor packaging and assembly [2683]

Home Online Power Packages Designer - 2D and 3D design / Semiconductor packaging and assembly [2683]

Power Packages Designer - 2D and 3D design / Semiconductor packaging and assembly [2683]

Full time at THE SUPREME HR ADVISORY PTE. LTD. in Online
Posted on December 18, 2024

Job details

WhatsApp: +65 90820021 (Kyler) Email: kylergan.supreme@gmail.com Location: Admiralty St, Singapore Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $5000 - $9500 Responsibilities:

  • Design with Customer support innovative package based on company technologies for Semiconductor Power Applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable
  • Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
  • Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
  • Itemize and correspond to design Issues with customers.
  • Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
  • Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
  • Recommend new design concepts and validate the concept feasibility using thermal/electrical modelling
  • Perform package reliability test according to the Semi standard specifications to ensure and improve the package robustness according to the mission profile defined by the customer or by application.
  • Follow the customer characterization and qualification of the power package
  • Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
Requirements:
  • Degree / Diploma in Electronic Engineering or equivalent
  • Good engineering foundation and technical knowledge
  • PCB / Substrate manufacturing knowledge
  • 2D and 3D design experience ( AutoDesk preferred )
  • Background on semiconductor packaging and assembly processes
  • Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance)
  • Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.
  • Senior and Staff level with at least 5 years experience in related field.
The Supreme HR Advisory Pte. Ltd | 14C7279 Gan Kai Le | R23112683

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