Home Malaysia Assembly Equipment Engineer (Semiconductor)

Home Malaysia Assembly Equipment Engineer (Semiconductor)

Assembly Equipment Engineer (Semiconductor)

Full time at Micron in Malaysia
Posted on May 8, 2024

Job details

Our Vision:

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.

Job Title:

Assembly Equipment Engineer (Semiconductor)

Description:

As an Equipment Engineer, you will oversee the installation, modification, upgrade, and maintenance of manufacturing equipment. This includes studying equipment performance and reliability to ensure production equipment is in control and the quality of the product meets expectations. You will also be responsible for sustaining and improving key performance indices of the equipment through continuous improvement activities, reducing costs through qualifying 2nd sources, ensuring an effective and efficient equipment risk management strategy, and developing new capabilities ahead of needs.

Responsibilities and Tasks:

  1. Implement a preventive/predictive maintenance program.
  2. Develop equipment maintenance specifications.
  3. Monitor equipment performance key indicators and ensure they meet expectations.
  4. Provide necessary production support.
  5. Establish a spare inventory system for key equipment.
  6. Monitor spare cost and drive down liabilities of spare inventories.
  7. Work with Purchasing to identify critical suppliers and develop a 2nd sourcing strategy.
  8. Identify key cost drivers and work on cost reduction programs.
  9. Define, develop, and maintain equipment capabilities, strategy, and roadmap.
  10. Maintain a matrix on equipment capabilities and constraints.
  11. Work with equipment suppliers to develop new materials/capabilities.
  12. Regularly conduct equipment benchmarking exercises.
  13. Work with equipment suppliers to develop new capabilities.
  14. Work with the Package Development team to establish production capabilities for new products.

Requirements:

Education: Master's/Doctorate in Mechanical, Mechatronics, Electrical & Electronics, or related Engineering fields. Skills: Excellent interpersonal, communication, and leadership skills with an extremely positive attitude towards working as a team. Self-motivated, possess initiative and ability to work independently. Very high attention to detail and data accuracy and quality. Team player with good communication and interpersonal skills.

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