الصفحة الرئيسية ماليزيا External Contractor - Advanced Package Design, Signal & Power Integrity

الصفحة الرئيسية ماليزيا External Contractor - Advanced Package Design, Signal & Power Integrity

External Contractor - Advanced Package Design, Signal & Power Integrity

دوام كامل في Career Wise في Malaysia
نُشرت يوم January 12, 2025

تفاصيل الوظيفة

Job Title: External Contractor - Advanced Package Design Signal and Power Integrity Requirements / Experiences:

  1. PhD/Master/Bachelor Degree in Electrical or Electronics or relevant field.
  2. Minimum 5 years semiconductor package development experience in circuit/PCB design and/or simulation.
  3. In depth knowledge in Transmission Line and Electromagnetic theory, DC/AC signalling concept in time and frequency domain analysis.
  4. Good understanding of Scattering Parameters for high speed signals and power delivery network design concept and implementation is a plus.
  5. Hands on experience using Design and/or Simulation Tools (Cadence, ANSYS, Mentor, AutoCAD, ADS, Spice, or any relevant).
  6. Desirable that candidate has experience working on IBIS model, Package/PCB level model extraction, full system voltage and timing simulation, lab measurements a plus.
  7. Good analytical skills on signal and power integrity analysis (Eye Diagram, Jitter, power noise, signal crosstalk, ringing, lossy attenuation, overshoot/undershoot, etc).
  8. Knowledge in high speed interface signal and power integrity design guidelines (LPDDR, PCIE, MIPI, USB, FPD Link, etc).
  9. Extensive lab experience and inspire to venture into simulation hands-on.
  10. Prior experience with SI work on different package platforms (BGA, Leadframe, Wafer Level) is a plus.
Job Descriptions:
  1. Part of Infineon Back-end Advanced Package Development Team.
  2. Responsible for package design, Signal and Power Integrity simulation, design verification for various Infineon products (Microcontroller, Memory, Power Devices, ASIC, RF, Sensor, etc).
  3. Perform/Lead Package and PCB electrical model extraction (RLC, PDN), voltage and timing simulation for signal and power integrity analysis using industry standard Engineering Tools.
  4. Develop/Lead design guidelines for High Speed interface (LPDDR, PCIE, MIPI, USB, FPD Link, etc).
  5. Involve in NPI of Semiconductor Packages design feasibility and turnkey with signal and power integrity focus.
  6. Participate/Lead simulation and measurement correlation activities, methodology development, continuous accuracy improvement.
  7. Work/Lead as a team across functionals with signal and power integrity centric for customer design adoption support activities.
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