GaN Package Architect

The most important aspect of a job description is to convey the responsibilities, qualifications, and expectations of the position accurately and clearly to potential candidates. This is your new job: - Explain the role and key responsibilities of the preferred candidate. Key Roles & Responsibilities: Being the Package Architect for GaN, he/she will ensure all design and technical construction of the new package/products for a GaN device are meeting the design requirements. He/She will define all relevant assembly materials and processes to meet the device and reliability performance target for the GaN product. These dissussions are normally done through a design review with GaN device engineers, Process development engrs and Design engineers of the Business group. Tools to be used must include but not limited to QFD, DFMEA, DFM including Assembly design rule checks and conduct risk assessments (to facilitate selection of design options or material selection or process selection); Conducts FEBE assessment to review critical changes at front end that may affect back end process to impact GaN product performance; Define assembly package design rules specific for GaN devices - What will the candidate work on. Candidate will work on GaN development projects for Nexperia, Cabuyao assembly site. Candidate will support FE/BE assessments for GaN and other key silicon technologies. - Describe the scope of daily tasks, project assignments, major challenges, and stakeholders. Daily tasks includes execution and follow-through completion of de-risking activities to meet the project schedules; Will handle at about 2 to 3 concurrent development projects; Must submit weekly project updates and communicate critical risks as needed for potential project show-stoppers This is you: - What is the profile of the required candidate? Candidate must be 20 years of experience in total in Semiconductor industry with a least 10 years actual hands-on in package development. - What is the preferred degree, education and experience level? Bachelor's Degree in Mechanical, Chemical, Chemistry, Physics, Material Science; Master's degree in any of these fields is a plus - Which requirements and qualifications are needed to succeed in this role (min. 3, max. 5 hard skills (differentiate in prerequisite/desired) (1) Understands and applies semiconductor package and assembly design rules in package design proposal/assessment (2) Define de-risking approach or methodologies for new packages (3) Manages and coordinates all de-risking activities to ensure project is meeting the target timing - What (soft) skills does the required candidate have? (min. 3, max. 5 soft skills (differentiate in prerequisite/desired) (1) ACAD - must have knowledge and ability to interpret drawings/tolerances (2) Gantt chart - must be able to create Gantt chart (3) Project proposal - must be able to create and present project proposal (to include infos on design proposal, development strategy and development expense, etc) (4) Good verbal and written communication skills Make sure you list down MUST have’s and NICE to have’s. This is your department and colleagues: - Write a short summary about the team and department. - What team building activities does your team/ department offer. This is what Nexperia offers: - Why should a candidate be excited about this job? Good to know: - Is there any specific information we need to integrate when creating the job description? E.g. travel is part of the job, if an assessment is part of the hiring process. Etc. Nexperia is an Equal Opportunity/Affirmative Action Employer.

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Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 15,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

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