Manager, Product Development Engineering

About the company: Our client is located in Penang, Malaysia, and is one of the state-of-the-art Assembly and Test service providers for high-performance computing and communication solutions. As one of the pioneer companies in Penang, their mission is to enable their global customers' success with leading-edge and differentiated high-value packaging solutions. Job Responsibilities:

• To lead a team of product development engineers to develop and establish assembly processesrecipe for new products through process characterization and process parameters optimization.
• Drive NPI to have APQP standard of handling over to HVM in meeting all KPI & Yield.
• Drive cost saving and process Cost of Ownership (COO) improvement through material selection,process cycle time improvement, productivityimprovement/innovation.
• Drive Yield & Quality KPI improvement through Lean Six Sigma approach.
• Program Management of new products' introduction.
• Sense of ownership & responsibility.
• Capable high-level reporting.
• Other duties assigned by supervisor.

• Education: Degree in Engineering (Material/Mechanical/Electrical/Electronic)/Applied Science(Physic).
• Language: English (Written & Spoken).
• Experience: Knowledge of Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis.
• Knowledge of Flip Chip PGA/BGA processes.
• Experience on creating recipe for Die Attach, Reflow oven, solder printing and chip attach will be anadded advantage.
• Ability to perform temperature profile characterisation for new product introduction.
• Good knowledge on SMT line/ flip chip process control / SPC/ CPK or other advanced packingcompetency.
• Familiar with equipment for example Datacon die attach, Heller/ BTU reflow oven and Dek solderprinting or any equivalent